二手翻新现货Nikon步进式光刻机 NSR G8A

ITEMS

Request & SPEC

Wafer size

200mm(8 Inch),

Wafer Loader Type

Type 1 & Type 2

Wafer

200mm (8 Inch)

Projection ratio

 5 : 1

NA Variable System

Exposure Field

 Installed , 0.50

22.0mm X 22.0mm

Reticle Size

6 Inch 

Reticle Library

9 Holds

Wafer Carrier Table

2 Carrier

Illumination Optical System

Yes

Field Image Alignment system

Yes

Laser Step Alignment system

Yes

Chip Leveling

Yes

Pre Alignment2

Wafer Alignment

Wafer Chuck

8-8 R-Type

Data Back up

Tape Driver

No.

Item

Specification

Results

1

Resolution

0.55µm  L & S

2

Long Term Focus Stability

Within ±0.30um

3

Auto focus repeatability

±0.15um（25 points measurement using WAFLAT）

4

Focuscalibration repeatability

3s ≤0.15um（10 times measurement）

5

Lens Stability

Within 0.05um（3 days measurement）

6

Focus Calibration Repeatability

3s £ 100 nm

       nm

7

Lens Distortion

within≤ ±0.07um

min      max

X:         ~        ㎛     

Y:         ~        ㎛

8

Magnification Control Accuracy

within ±15 nm

H - I:                nm

C - I:                nm

9

Maximum Exposure Area

 22.0mm(hor.) x 22.mm

10

Reticle Blind Setting Accuracy

+0.4 mm to +0.8 mm

 Xp:     mm ; Xm     mm

 Yp:     mm ; Ym     mm

11

Exposure Power

³ 550 mW/cm²

                 mW/cm²

12

Illumination Uniformity

Within ± 1.5%

13

FIA Telecem

±3 mrad

X:           mrad

Y:           mrad  

14

FIA Focus

±2 ㎛

X:           ㎛

Y:           ㎛

15

LSA Telecem

±3 mrad

X:           mrad

Y:           mrad  

16

LSA Focus

±2 ㎛

X:           ㎛

Y:           ㎛

17

Intergrated Exposure Stability

(1) within ±1.2%

(2) within ±0.5%

100：      mJ/cm²

200：      mJ/cm²

400：      mJ/cm²

800：      mJ/cm²

18

Wafer Holder Flatness

Within 1.5μm / 200mm

Max≤0.8um

Max – Min：1.5UM

Max ：0.8UM

19

Chip Leveling

Within ±5 μrad

X :            Y:

R:             P:

20

Auto Focus Stability

Within  0.4 ㎛ (range)

21

Reticle Rotation

Absolute value

Within ±0.02㎛

OF target value

Repeatability

Within 0.02㎛

Absolute value:

Repeatability:    

22

Array Orthogonality

Within ±0.1 sec

（ortmortm90)/2≤ ±0.3 urad

                  sec

ORTM:         μrad

ORTM90:         μrad

23

Stepping Precision

Within ±0.075㎛ (3σ)   

3 Sigma X:

3 Sigma Y:

24

Overlay-LSA  

lXl+3σ＜0.12㎛

X:          Y:

25

Overlay-FIA

lXl+3σ＜0.12㎛

X:          Y:

26

WL Repeatability

Within 15㎛ (3σ)

3 Sigma X:

3 Sigma Y:

3 Sigma T:

27

Lens Matching

|mean|+3s < 0.17um

28

Operational Test

(1)  Wafer System

(2)  Reticle System

(1)  Success rate: ³ 99 %

(2)  Success rate: 100 %

          %

          %